Caratteristiche Tecniche
CERTIFICATION
Ul file E1234044 dal 1991
UNI EN ISO 9002 dal 1998
PRODUCTS
Single side
Double side
Multilayers
Teflon
High TG materials
Alluminio
TECHNOLOGICAL CHARATERISTICS
Minium hole: 0,15 mm
Minium coductor width: 100 micron
Minium isolation: 100 micron
Aspect ratio: 6:1
Pressfit
Bling and buried vias
Number of layers: 10
Board thickness: da 0,1 a 5 mm
Copper thickness: 17-35-70-105-150 micron
ENGINEERING SYSTEMS
Genesis software
Cad Software CAM350